HeatFlow Technologies™ is exclusively founder funded. We would like to develop relationships with future potential investors, who might be interested in joining future funding rounds. We anticipate seeking that funding in late 2010 or early 2011, depending when our initial prototype testing is complete.
Please email your contact information to the CEO and President of HeatFlow Technologies™, Warren Dinges. He will contact you and arrange a meeting or conversation. All contact information will remain private and not distributed in any manner outside HeatFlow Technologies™.